Chemical mechanical polishing Technique

Chemical mechanical polishing:
Chemical mechanical polishing (CMP) is a process that, during the past 20 years, has achieved a high level of importance in various industrial sectors, particularly in microelectronics. During the last 5 years, various technological advances have occurred in this field, leading to increased market demand for CMP equipment and materials.
The main goal of this report is to provide new insights into current CMP technology, outlining technological trends, and supplying an updated market analysis of equipment and materials utilized for chemical mechanical polishing.
Specifically, the major objectives of this study are to:
1. Provide an updated revie w of the chemical mechanical polishing process and related equipment, focusing on the most advanced equipment upgrades and variants.
2. Provide an overview of materials commonly used in chemical mechanical polishing and identify new materials.
3. Highlight new technological developments in chemical mechanical polishing, while outlining technical issues.
4. Review the fields of application for CMP and investigate emerging applications.
5. Estimate current global markets for CMP equipment and materials (including CMP and post-CMP equipment, CMP slurries, CMP pads and pad conditioners) with growth forecasts through 2013 for each market segment.
6. Identify important technology and market trends within each market segment.
7. Supply an updated review of current producers of equipment and materials for chemical mechanical polishing.
8. Identify major users of CMP equipment, slurries, pads and pad conditioners.
9. Provide a description of current worldwide research activities and evaluate their impact on industry growth.
10. Determine trends in U.S. patents issued during the most recent years

This report contains:
* Provides an in-depth analysis of CMP technology and its applications
* Analyzes and forecasts the size and future growth of the markets for CMP and post-CMP equipment, slurries, pads and pad conditioners, and other consumables, with forecasts through 2012
* Identifies major users and end-uses.
* Identifies the technological issues related to CMP
* Examines major new R&D and technology changes and their impact on CMP
* Analyzes domestic and foreign competition among companies within each market segment
* Profiles all worldwide producers of CMP and post CMP equipment and materials
* Includes market shares, industry structure and patent analysis.